70Khz Ultrasonic Wire Embedding Device For Contactless Payment Industry

70Khz Ultrasonic Wire Embedding Device in the Contactless Payment Industry

Brief Introduction:

Radio frequency identification (RFID) inlays are manufactured throughout the world for many purposes: biometric passports, the contactless smart card market (e-ID, electronic healthcare cards, payment cards, public transportation), and for dual interface applications. At the same time, wire-embedded high frequency (HF) RFID antennas are available and offer a number of advantages over printed, etched, or galvanized variations.

Among others, the ability to freely select shapes is enticing for card and passport manufacturers, since this can lead to competitive advantages. Further benefits, such as environmental friendliness, durability, and improved product quality, also should be mentioned.

Parameters:

Benefits:

In the production of Bank card, smart card and VIP, which need to dip tin coils and then welding.

ultrasonic welder can welding wire directly, the welding spot has the following benefits:

1. welding spot firm, prevent to cold Weld.

2. same size welding spot, consistency.

3. welding spot small, easy to press fit package.

4. eliminating the need for pre-welded solder dip process,can hire less one operations staff.

5. its welding is faster than iron.

6. the production process will not produce exhaust gas waste pollution.

7. 70KHz ultrasonic unit, speed welding, low production costs.

8. Stable frequency of ultrasonic automatic planting line machine, and could adjust frequency according to customer requirements.

Compare with etching antenna technology:

Ultra-thin IC card is made possible by ultrasonic embedding process.It will effectively solve the problem of the failure of etching antenna technology in the application of ultra-thin IC card, which can reduce the scrap rate and reuse cost.The ultra-thin IC card produced by using the ultrasonic embedding process is the same as the IC card manufactured by the traditional process, so its average service life will be longer than the ultra-thin IC card produced by using the etching antenna (6 years) process. Two different processes, the material difference is mainly in the antenna part, the antenna material used in the etching antenna process is a PET (polyethylene terephthalate, PET) sheet with a thickness of 0.078 mm and a precision etched aluminum wire, and Ultrasound embedding process antenna for enameled copper wire, the same production performance of an IC card, according to the material price of etching antenna price is about 2 times the price of copper, so the use of ultrasonic embedding process to produce ultra-thin IC card The price is also slightly better. The mass production of ultra-thin IC CARDS will have a profound impact on the continuous development of the smart card industry.

EVEN MORE FREEDOM FOR ANTENNA EMBEDDING

Antenna layouts, which previously depended on the position of the chip, now can be produced and placed freely and independently. Production steps, such as cutting the antenna free for producing an electrically conductive connection between the module and antenna—as was previously required for the production of dual interface cards—are no longer necessary. Since the mechanical-electrical connection is no longer needed, the cards are much more durable.

THE CHALLENGES? QUALITY AND PRECISION!

The most basic prerequisite for the function of this technology is the embedding of the antennas with consistent quality and uniform frequency even when using 12 wire-embedding heads. Particularly when embedding antennas with very small winding distances, high precision is a must. In the future, mechanical engineers from the area of RFID inlay production will have to face this challenge in order to remain competitive on the market.

70Khz Ultrasonic Wire Embedding Device in the Contactless Payment Industry

Workshop:

Hangzhou Altrasonic Technology Co., Ltd

Located in Hangzhou, China, was found in 2010. Altrasonic has many years' experiences in the business of industrial ultrasonic components and ultrasonic devices in China. We use this experience and experise to provide only the best ultrasonic devices and components based on the competitive price.

Altrasonic equipment focused on the r&d of high power ultrasound applications, Altrasonic has absolute leading 
core technology, the most stable and mature manufacturing technology, rich experience, can provide direct 
ultrasonic application scheme demonstrate, structure design, system configuration and related parts production.

Altrasonic equipment cooperated with the key graphene manufacturers, applied the ultrasound equipment in 
graphene preparation process of industrialization firstly, and make the ultrasonic be a good supporting to the large-scale preparation of the high quality and low cost graphene materials. 

Our company mission:Ultrasonic Technology makes life easier.

WHY CHOOSE ALTRASONIC ?

• OVERSEA SERVICE TEAM. We now have agents in India, Austrilia, Indonesia, Singapore, Türkiye, Malaysia,  Germany, and other country still being discussing.

• Innovation. Altrasonic R&D and marketing staffs to constantly explore new applications in the field of ultrasound,  and the importance of team spirit of cooperation.

• Half the price, double the value. Every product reach you have been test in our company three times, and with  72 hours continous working, to confirm it is well before you get it. Also we always learn from foreign company, to 
 upgrade our products.

• Good components. Ceramic mainly imported from German, and using the superior quality aluminum, titanium raw materials.

• Individual Customize. We can customize products according to your requirements, Also supply OEM service. 

 Customize ultrasonic solution for different applications.